QA Manager
Hải Phòng (On-site)
Nghỉ trọn T7, CN
Hạn chót 13/12/2026
Đăng 11 giờ trước
Ít hơn 5 ứng viên
Yêu cầu công việc
- Bachelor’s degree or higher in an engineering-related field; able to communicate in English
- Preferred majors: Chemical Engineering, Materials Science, Electrical/Electronic Engineering, Mechanical Engineering, Industrial Engineering, etc.
- Candidates with 3+ years of experience are preferred
- Technical Knowledge:
• Deep understanding of package substrate manufacturing processes (e.g., SAP/mSAP, lithography, plating, lamination, surface finishing like ENIG/ENEPIG, electrical testing, and AVI/AOI).
• Strong proficiency in quality core tools: 8D, FMEA, MSA, SPC, APQP, PPAP, and Root Cause Analysis (5-Why, Fishbone).
• Familiarity with reliability testing standards (JEDEC, IPC) and failure analysis (FA) techniques (X-ray, cross-section, SEM/EDX).
* For Customer Quality Team Leader, fluent English is preferred
Yêu cầu nên có
Preferred major in Chemical Engineering, Materials Science, Electrical/Electronic Engineering, Mechanical Engineering, Industrial Engineering, or a related field 3+ years of experience Fluent English for the Customer Quality Team Leader role
Công việc cụ thể là gì?
■ Package Substrate Product Quality Manager:
- Quality Management System (QMS): Develop, implement, and maintain QMS in compliance with international standards (such as ISO 9001, IATF 16949, and IPC standards). Lead internal and external quality audits.
- Customer Quality Engineering (CQE): Act as the primary point of contact for global semiconductor customers regarding quality issues, audits, and product qualifications. Manage customer complaints, RMA (Return Material Authorization), and drive timely 8D / CAPA resolutions.
- Supplier Quality Management (SQM): Establish supplier quality standards, conduct supplier audits, and monitor the performance of raw material vendors (e.g., copper foil, prepreg, dry film, solder mask).
- Process & Product Quality Control: Oversee IQC, IPQC, OQC, and Reliability Testing (ORT) teams. Monitor yield rates, defect trends, and statistical process control (SPC) data to prevent quality excursions.
- New Product Introduction (NPI): Partner with R&D, Process Engineering, and Production teams during NPI phases to ensure smooth qualification (APQP, PPAP, FMEA, Control Plans) of next-generation IC substrates (e.g., FC-BGA, FC-CSP).
- Team Leadership & Continuous Improvement: Lead, mentor, and develop a team of QA/QC engineers and inspectors. Champion Lean Six Sigma methodologies to reduce defect rates (DPPM) and improve overall manufacturing yield.
• Ngày làm việc: T2 - T6 • Giờ làm việc: 09:00 - 18:00 • Cấp bậc: Quản lý • Loại công việc: Toàn thời gianQuyền lợi có gì?
Lương thưởng
Lương Tháng 13, Thưởng KPI
Khác
Làm việc từ thứ 2 ~ Thứ 6 và Nhiều quyền lợi khác






