Signal & Power Integrity (SI/PI) Hardware Expert - Joining Bonus
Quận Tân Bình, Hồ Chí Minh (On-site)
Nghỉ trọn T7, CN
Hạn chót 02/12/2026
Đăng 10 ngày trước
Hãy là ứng viên đầu tiên
Yêu cầu công việc
Must-have
- Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, or a related field.
- 8+ years of experience in electronic hardware engineering, including substantial hands-on experience in Signal Integrity and/or Power Integrity analysis for complex board-level designs.
- Strong fundamentals in electromagnetics and transmission-line theory, including impedance, coupling, reflections, return paths, S-parameters, and time/frequency-domain analysis.
- Hands-on experience with SI/PI simulation and analysis for high-speed digital hardware.
- Experience analyzing high-speed interfaces such as DDR/LPDDR, PCIe, Ethernet, SerDes, or comparable technologies.
- Strong understanding of PDN design and analysis, including IR drop, impedance, decoupling, resonances, and transient behavior.
- Practical experience with schematic/PCB layout review, PCB stack-ups, high-speed routing constraints, and board-level hardware validation.
- Experience with one or more SI/PI simulation environments such as Ansys SIwave/HFSS/Q3D, Cadence Sigrity/Clarity, Siemens HyperLynx, Keysight ADS, or equivalent tools.
- Ability to correlate simulations with laboratory measurements and translate analysis results into practical PCB/package design recommendations.
Preferred
- Experience with SoC-based board design, including power, clock/reset, memory, and high-speed interfaces.
- Experience with IBIS/IBIS-AMI, S-parameters, and 2D/3D EM extraction workflows.
- Knowledge of HDI, fine-pitch BGA routing, package parasitics, and PCB/package co-design.
- Experience with advanced laboratory equipment such as TDR, VNA, or BERT.
- Knowledge of EMI/EMC, DFM, and DFT.
- Python or MATLAB experience for simulation automation and data analysis.
- Experience in automotive electronics, automotive HPC, chiplet/package-board co-design, or UCIe is an advantage.
Yêu cầu nên có
Experience with SoC-based board design, including power, clock/reset, memory, and high-speed interfaces. Experience with IBIS/IBIS-AMI, S-parameters, and 2D/3D EM extraction workflows. Knowledge of HDI, fine-pitch BGA routing, package parasitics, and PCB/package co-design. Experience with advanced laboratory equipment such as TDR, VNA, or BERT. Knowledge of EMI/EMC, DFM, and DFT. Python or MATLAB experience for simulation automation and data analysis. Experience in automotive electronics, automotive HPC, chiplet/package-board co-design, or UCIe.
Công việc cụ thể là gì?
- Define SoC board specifications, select components, and develop schematics, design requirements, and verification criteria.
- Design and review power architecture, sequencing, clock/reset circuits, memory, and high-speed interfaces such as PCIe Gen 3/4/5, LPDDR5, USB 3.x, SGMII/RGMII, and Automotive Ethernet.
- Review PCB placement, routing, stack-up, fabrication readiness, power budgets, thermal margins, and reliability with development and manufacturing partners.
- Own SI/PI simulation plans, budgets, and acceptance criteria, and perform pre-layout and post-layout analysis for high-speed interfaces such as DDR/LPDDR, PCIe, Ethernet, and SerDes.
- Analyze insertion/return loss, crosstalk, reflections, timing, jitter, eye diagrams, and design margins.
- Build and validate PCB/package models using 2D/3D electromagnetic extraction, S-parameters, and IBIS/IBIS-AMI, while assessing model accuracy and limitations.
- Perform Power Delivery Network (PDN) analysis including IR drop, current density, impedance, resonances, and transient behavior; optimize power/ground structures and decoupling strategies.
- Derive PCB/package design constraints covering stack-up, materials, controlled impedance, routing, vias, return paths, and decoupling.
- Correlate simulation results with laboratory measurements using oscilloscopes, TDR, VNA, and other relevant equipment, and resolve simulation-to-measurement discrepancies.
- Lead SI/PI technical reviews and issue resolution; develop reusable simulation flows, scripts, reports, and engineering guidelines.
- Support EMI/EMC analysis and troubleshooting as required.
- Prepare technical documentation, including application notes and customer-facing engineering materials.
Quyền lợi có gì?
Lương thưởng
13th-month salary bonus + attractive performance bonus (you'll love it!) + annual performance appraisal
Bảo hiểm & sức khoẻ
Premium health insurance for employee and 02 family members
Cân bằng công việc-cuộc sống
15++ days of annual leave + 1-day of birthday leave
Học hỏi & phát triển
Engage in our diverse training programs which surely help strengthen both your personal and professionalism
Văn hoá công ty
Good benefits of company activities such as: football, badminton, yoga, Aerobic, team building…
Khác
Working in one of the Best Places to Work in Vietnam and Top 30 of the Most Innovative Companies all over the world
Join in a dynamic and fast-growing global company (English-speaking environment), with opportunity to work in global projects and bein








